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Produktbeschreibung
HP DL580 Gen9 E7-8870 v3 1P Kit
Produktinformationen
CPU heat sink: | included |
Allgemein | |
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Produkttyp: | Prozessor |
Informationen zur Kompatibilität | |
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Entwickelt für: | HPE ProLiant DL580 Gen9, DL580 Gen9 SAP HANA Scale-out Base Configuration, DL580 Gen9 SAP HANA Scale-up Base Configuration |
Prozessor | |
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Anz. PCI Express Lanes: | 32 |
Anz. der Kerne: | 18 Kerne |
Anz. der Threads: | 36 Threads |
Architektur-Merkmale: | Enhanced SpeedStep technology, Hyper-Threading-Technologie, Unterstützung für Execute Disable Bit, Intel Virtualization Technology, Intel Turbo Boost Technology, Intel 64 Technology, Intel Trusted Execution Technology, Intel AES New Instructions (AES-NI), Thermal Monitoring Technologies, Intel VT-x with Extended Page Tables (EPT) |
Cache-Speicher: | 45 MB |
Cache-Speicher-Details: | 45 MB |
Herstellungsprozess: | 22 nm |
Max. Turbo-Taktfrequenz: | 2.9 GHz |
PCI Express Revision: | 3.0 |
PCI Express-Konfigurationen: | X16, x4, x8 |
Prozessoranz.: | 1 |
Taktfrequenz: | 2.1 GHz |
Temperaturspezifikationen: | 75 °C |
Thermal Design Power (TDP): | 140 W |
Typ / Formfaktor: | Intel Xeon E7-8870V3 |
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