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Lenovo - 8869C4J - Lenovo System x3550 M5 Server 2,1 GHz Intel® Xeon® E5 v4 E5-2620V4 Rack (1U)

Lenovo - 8869C4J - Lenovo System x3550 M5 Server 2,1 GHz Intel® Xeon® E5 v4 E5-2620V4 Rack (1U)
  • 10201906-014
Artikel-Nr.: 10201906-003
auf Anfrage

Lieferzeit ca. 5 Tage

Artikel-Nr.: 10201906-014
auf Anfrage

Lieferzeit 3 Werktage

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  • 3 Jahre Garantie
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Produktbeschreibung



Herstellerinformationen:
Lenovo (Deutschland) GmbH
Meitnerstraße 9
70563 Stuttgart Deutschland
0711 6569 0807
Fragen_DE@lenovo.com
https://www.lenovo.com/de/de/legal/impressum/?orgRef=https%253A%252F%252Fwww.google.com%252F&srsltid=AfmBOorDoGrNzbGThMjMzlfqUZwh7ywkgdIVq6dl2Y_AGn0PpvXU2i4C
Design
Chassis type: Rack (1U)
Memory
ECC: Y
Internal memory: 16 GB
Internal memory type: DDR4-SDRAM
Maximum internal memory: 768 GB
Memory clock speed: 2133 MHz
Memory layout (slots x size): 1 x 16 GB
Memory slots: 24
Power
Redundant power supply (RPS) support: Y
Processor
Bus type: QPI
Conflict-Free processor: Y
ECC supported by processor: Y
Embedded options available: Y
Execute Disable Bit: Y
Idle States: Y
Maximum internal memory supported by processor: 1536 GB
Maximum number of PCI Express lanes: 40
Memory bandwidth supported by processor (max): 68.3 GB/s
Memory channels supported by processor: Quad
Memory clock speeds supported by processor: 1600,1866,2133 MHz
Memory types supported by processor: DDR4-SDRAM
Motherboard chipset: Intel® C612
Number of QPI links: 2
Number of processors installed: 1
Physical Address Extension (PAE): 46 bit
Processor boost frequency: 3 GHz
Processor cache: 20 MB
Processor cache type: Smart Cache
Processor code: SR2R6
Processor codename: Broadwell
Processor cores: 8
Processor family: Intel® Xeon® E5 v4
Processor frequency: 2.1 GHz
Processor lithography: 14 nm
Processor model: E5-2620V4
Processor operating modes: 64-bit
Processor package size: 52.5 x 51 mm
Processor series: Intel Xeon E5-2600 v4
Processor socket: LGA 2011-v3
Processor threads: 16
Scalability: 2S
Stepping: R0
Supported instruction sets: AVX 2.0
System bus rate: 8 GT/s
Tcase: 74 °C
Thermal Design Power (TDP): 85 W
Thermal Monitoring Technologies: Y
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